Material Science

For the past ten years Ormet has been developing and perfecting applications of its ink and paste products based on the Company`s unique liquid phase sintering technology. This work resulted in twelve patents to date. During the past two years the Company made significant advances in the refinement and commercialization of this technology. This effort resulted in a family of products, including lead free versions that are now being introduced to the industry. Ormet is currently supplying initial quantities of Ormet inks to several large companies both in the U.S. and Asia who are evaluating them for use in their products.

The uniqueness of Ormet`s products lies with their high conductivity and their ability to withstand high temperatures after curing. This makes them particularly well suited for a variety of critical applications in the electronics industry. These products are composed of metallic particles and organic materials. After a relatively short curing cycle at about 190° C, the metallic particles become alloyed to form a highly conductive structure. After curing, this structure retains its integrity and form and will not reflow even when exposed to temperatures in excess of 300° C. Its conductivity is about ten times that of the best metal-filled epoxies and it will readily form a molecular bond to copper during the cure cycle. The ink`s thermal coefficient of expansion is very close to that of copper and it can also be plated.

   260C - Ormet 260C Technical Data Sheet
Ormet 260C is a lead-free conductive paste used to create conductive interconnections in semiconductor packaging and printed circuit board applications.
updated 22-May-2010 15:26:21

   555 - Ormet® Lead Free 555
Ormet 555 is a lead-free die attach conductive paste used to form conductive interconnection between an IC and a metal substrate
updated 22-May-2010 17:25:15

   580 - Ormet® Lead Free 580
Ormet 580 is a lead-free die attach conductive paste used to form conductive interconnection between an IC and a metal substrate
updated 22-May-2010 17:25:15

   700 - Lead Free TLPS Composition for 700 Z Axis Interconnect Paste
Ormet’s patented lead free via inks enables high density interconnects in the Z axis. Ormet enables solid blind and buried vias in the adhesive layer of a typical fabricated printed circuit board. (RF, Flex and Rigid Assemblies)
updated 22-May-2010 08:02:51

   701 - Lead-free Conductive Paste Ormet 701
Ormet 701 is a lead-free conductive paste used to fill micro via structures that create z-axis interconnections between circuit layers in semiconductor packaging and printed circuit boards.
updated 22-May-2010 08:02:51

   800 (802) - TLPS Lead Free Composition for 800 Hole Filling Paste
Lead free Ormefill Via Plug is used to provide highly conductive plated vias for PBGAs, RF signal connections and standard printed wiring board substrate fill.
updated 22-May-2010 15:26:21

   2600 - Ormet® 2600 Conductive Screen Printable Paste
Ormet 2600 is a screen printable , electrically conductive ink. The material is solderable and can be applied to many inorganic and organic substrates including paper. Initially, the product has a long record of being used to modify signal circuits on printed wiring boards. Most recently, it has been used in the manufacture of RFID antennas while attaching its the silicon die.
updated 18-Apr-2009 08:02:51

   7001 - TLPS Composition for 7001 Z Axis Interconnect Paste
Ormet’s patented via inks enables high density interconnects in the Z axis. Ormet enables solid blind and buried vias in the adhesive layer of a typical fabricated printed circuit board. (RF, Flex and Rigid Assemblies)
updated 18-Apr-2009 08:02:51

   MATERIAL SAFETY DATA SHEET
MATERIAL IDENTIFICATION Ormet® 800, 700, 500 series inks
updated 18-Apr-2009 08:02:51

   Ormet® materials do not remelt - Transient Liquid Phase Sintering (TLPS)
DSC Analysis of Ormet 500,700,800 Lead Free Composition
updated 18-Apr-2009 08:02:51

   Application Guide: Ormet Core-to-Core Interconnect
This document defines a step-by-step procedure for printed circuit manufacturers to make Ormet® conductive interconnects between copper cores. These guidelinespertain to Ormet™ 7001 and 700 conductive pastes.
updated 22-May-2010 08:02:51

   Ormet® family of products
Complete list of product family applications and publications
updated 22-June-2009 17:25:15

   Ormet® materials do not remelt - Transient Liquid Phase Sintering (TLPS)
DSC Analysis of Ormet 500,700,800 Lead Free Composition
updated 30-June-2009 09:15:06

   Ormet® technology overview presentation
PowerPoint® presentation
updated 22-May-2010 09:15:06