RoHS Compliant Z-Interconnect Paste

March 1, 2010

San Diego, CA.--(BUSINESS WIRE)—Ormet Circuits Inc. has released its next RoHS compliant Z-Interconnect paste for use in multilayer printed wiring board structures. Ormet’s Z interconnect pastes are used in Military, Telecommunications and network server boards, Personal Digital Assistants, RF assemblies and smart phones.

Ormet 701 material provides designers and fabricators a powerful material and process solution enabling current PWB manufacturing processes to meet Original Equipment Manufacturers (OEM) high-density designs with higher yield and reliability. The manufacturing improvements permitted by Ormet’s materials promote limited lamination cyclesshortened production time, andreduced overall PWB costs. The Ormet paste extends the fabricators’ toolbox for placing micro-vias in any layer at any location within the PWB.

Ormet 701 is a transient liquid-phase sintered (TLPS) paste that is a composite metal and polymerbased material that undergoes dynamic structural changes during low-temperature heat treatment. During processing, a continuous metal network is created between the paste’s metal particles and the adjoining metal layers in the multilayer substrate. The resulting metal network is highly electrically and thermally conductive and exhibits stable properties above 265°C.

“PWB Fabricators are asking for tools and materials that save on processing time, reduces cost, and yet offers the same reliability of their current structures,” says James Haley, Company Vice President, for Ormet Circuits Inc. “This new release makes it possible for fabricators to increase capacity without adding additional capital equipment. It also gives designers greater freedom over the current standards, while still meeting essential reliability data curves that are accepted by the industry.”

Ormet Circuits, Inc. was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. The company occupies an 18,000 square foot facility in San Diego that had previously been Honeywell Incorporated’s Advanced Polymer Operation. The building has explosion-proof laboratories, Class 1000-10,000 clean rooms and extensive production and analytical equipment.

For additional information on Ormet 701, call (858) 831-0010 or email support@ormetcircuits.net.

October 15, 2009

Breakthrough Sintering Conductive Paste

for Fine Feature Electrical Interconnects

San Diego, CA – October 19, 2009 – Ormet Circuits today announced the availability in production quantities of a new conductive paste for fine line dispensing applications. Designated Ormet 260C, this unique Lead-free material exhibits a patented ‘Transient Liquid Phase Sintering’ reaction that enables low temperature curing and robust electrical and mechanical stability. Compared to silver filled epoxy materials, Ormet 260C is significantly more electrically stable after temperature cycling and exposure to Pb-free solder reflow temperatures. Ormet 260C has been formulated with a patent-pending metal filler package specifically designed for the ability to be dispensed in line widths down to 80-100microns.

After Ormet 260C is jet dispensed in a pattern, where the lines are 100 microns wide, and the serpentine is created at a 200 micron pitch, the material is cured either in a belt reflow oven or in a box oven. The rheology of Ormet 260C is tailored to prevent spreading, or slumping, of the material while wet or during the cure process. Long term dispensing experiments using an Asymtek DJ9000 jet dispenser have verified a high process capability, showing robust 100 micron line width, 150 micron pitch capability, and 12 hours working time.

Ormet’s unique sintering technology enables Ormet 260C to be cured as low at 165C in a box oven, or IR reflow oven. When cured, Ormet 260C bonds well to both metal and polymer surfaces, and has been qualified to interconnect and enhance the electrical performance of electronics devices. A feature of Ormet 260C is that it will metallurgically bond to solderable surfaces, and adhesively bond to polymer surfaces. This attribute provides enhanced electrical resistivity versus conductive adhesives, and a broader range of bonding applications than solders. Additionally, after Ormet 260C is cured, the material retains a solderable surface for a subsequent assembly process. Overall, Ormet 260C is a robust solution for creating fine lines and traces, and is an ideal paste for a range of applications in the solar and microelectronic markets.

“Ormet 260C is truly a breakthrough product in that it enables alternate techniques for forming electrical interconnections within a range of microelectronic and solar applications. The low sintering temperatures used to cure 260C enable the use of traditional solder or adhesive cure equipment, and will enable customers to design new semiconductor assembly processes where components are interconnected in a 3-D space using dispensing technology,” stated Ken Holcomb, VP of Engineering at Ormet Circuits. “At a time when the competitive marketplace demands new products at reduced cost and minimum capital investment, I believe we have a unique product in Ormet 260C compared to traditional conductive adhesives and low melting solders,” he added.

Ormet Circuits, Inc. was incorporated in 2003 to manufacture and market conductive pastes and inks for the printed circuit board fabrication and microelectronics industries. The company occupies a 18,000 square foot facility in San Diego that had previously been Honeywell Incorporated’s Advanced Polymer Operation. The building has explosion-proof laboratories, Class 1000-10,000 clean rooms and extensive production and analytical equipment.

For additional information on Ormet 260C, call (858) 831-0010 or email support@ormetcircuits.net.

September 30, 2009

NEWS RELEASE

NEW TAIWAN/CHINA REPRESENTATIVE

FOR ORMET CIRCUITS

San Diego, CA – September 30, 2009 – Ormet Circuits, Inc today announced Hypersonic Inc. as its sales representative for Taiwan and China for the semiconductor packaging materials market. Managed by Tony Chen, Hypersonic has a broadly capable technical sales staff with expertise in electronic materials and equipment. Strategically located in Jung Li, Taiwan and Shanghai, China, Hypersonic intends to supply a complete line of electronic materials to semiconductor packaging companies thereby enabling them to commercialize advanced semiconductor packaging designs.

Ormet Circuits offers a range of conductive pastes and inks for printed circuit board fabrication and IC packaging applications, featuring high electrical and thermal conductivity, Pb-free reflow compatibility, and RoHS and Halogen free compliance capabilities. In addition, a number of materials are available as an alternative to Gold wirebonds and for high power LED die attach applications.

“We are proud to join forces with Tony Chen and the Hypersonic team,” remarked James Haley, VP of Sales for Ormet Circuits. “The reputation and expertise of the Hypersonic organization is well known in the industry. We are truly excited about the opportunities available to us through their extensive contacts and years of experience in the Taiwan and China semiconductor markets. Overall, Ormet’s sales coverage in Asia now includes both Hypersonic and Globe Electronic Corporation, who handles the PCB Fabrication market for Ormet Circuits.”

Ormet Circuits was incorporated in 2003 to commercialize, manufacture and market conductive pastes and inks based on its patented ‘Transient Liquid Phase Sintering technology. Products are currently in commercial use in the Microelectronics and Printed Circuit Board fabrication industries. The company occupies a 18,000 square foot facility in San Diego that has Class 1,000-100,000 clean rooms and production areas, and extensive production and analytical equipment for volume manufacturing of its conductive compounds.

For more information on Ormet Circuits call 858 831-0010 or visit www.ormetcircuits.com.

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July 31, 2008

I am pleased to announce that Mr. Michael Matthews has joined the Ormet Circuits team as President. In this role Mike will lead the development, sales and manufacturing activities of the company. His goal is to grow the company into a major supplier of conductive pastes using Ormets unique, proprietary Transient Liquid Phase technology.

Mr. Matthews was most recently Business Manager of Global Business Development at Ablestik Laboratories. During his 13 year career at Ablestik Laboratories, Mr. Matthews held positions in the Technical Service, Sales, and Marketing functions as well as serving on Ablestik’s Global Leadership Team. Michael also served in key roles managing Ablestik’s global die attach and flip chip assembly material product lines. Mr. Matthews holds a B.S. Materials Engineering from Rensselaer Polytechnic Institute and a MBA from Pepperdine University.

Patrick Rivelli

Chairman

Technical Paper Sessions are in full swing and the latest presentation from Ormet Circuits, Inc. can be witnessed at two events in November. The first presentation takes place in Anaheim California and is sponsored by CircuiTree Magazine. Please find details at their web site: www.circuitreelive.com The second session will take place in San Jose California at IMAPS. Please visit: http://www.imaps.org/imaps2007/techprogram.htmv. Explanation and descriptions will be offered to install interconnects without drilling through the top and bottom side copper layers. Contact us at Support@ormetcircuits.net for more information on using our materials and patented process to improve your yields.

November 1, 2007.

Ormet Circuits, Inc. meets its revenue target for the first half of 2007. The customer momentum for new designs and proven process guidelines continue to foster growth for Ormet. OEM design initiatives are challenging the current process methods and allowing Ormet to provide interconnect solutions to save time, space and improve fabricator product yields. The ability to create sub assembly cores, test them and join them together in one final lamination step is becoming very desirable to manufacturing. Ormet’s ability to offer standard materials with standard equipment to the PCB fabricator greatly enhances the OEM customer base for Military, Medical and High-Density commercial products being built on schedule and within budget. Contact us at Support@ormetcircuits.net for more information on using our materials and patented process to improve your yields.

August 19, 2007.

Ormet Circuits, Inc and HDI Via Fill find the right combination to fill your plated through-hole needs. Ormet™ conductive materials that offer RoHS and Lead free compliance are now available through HDI Via Fill Services. The Ormet materials are installed through HDI’s unique high volume process that will deliver the following features: Planar surface, Tg=0, CTE of 22 as measured from 25ºc to 250ºc and thermal conductivity of 25W/mk. Contact us at Support@ormetcircuits.net for more information on using HDI as your via filling source.

May 23, 2007

Ormet Circuits, Inc works with Rogers Corporation Advanced Materials Division to install its Conductive material in Jade R/Flex product line. The Jade is a Halogen Free adhesive system that has a high Tg, superior thermal and dimensional stability that makes it ideal for mechanically drilling via holes for filling with Ormet 700 and 7000 series family of materials. The combination of materials allows thin product builds, parallel building for high sub assembly yields and lowers cost to manufacturing. Contact us to learn how your team can work with these next generation materials. Support@ormetcircuits.net

April 30, 2007

Ormet Circuits, Inc works with R&B Design to replace its current via in pad designs using Ormet™ conductive materials to construct their outer layers. Visit R&B Design at the Del Mar Electronics Fair to understand how this technology lowered cost while lowering RF interference. Support@ormetcircuits.net

April 6, 2007

Ormet Circuits, Inc surpasses its investment goals as it nears its quarters end. The company also outperformed against its plan for five consecutive quarters and is on schedule to reach its 2007 revenue objectives. Support@ormetcircuits.net

March 16, 2007

Ormet Circuits, Inc presents its conductive adhesive for trial use in customer applications. Several applications are being considered for this material due to its lower curing temperatures (190ºc) while maintaining Lead Free and RoHS compliance. Contact us regarding our 500 series family of products. Support@ormetcircuits.net

Feb 12, 2007

Ormet Circuits, Inc has been contracted by Raytheon to set design rules for use of its inks in their next generation RF products. Ormet materials were chosen for their ability to make Z-axis interconnects at any layer or location in the RF design. Limited through- hole plating promotes better RF signal, supports parallel building, offers higher yield and subsequently lowers Raytheon’s cost per panel. Contact us at Support@ormetcircuits.net for building with Ormet™ conductive materials.