Ormet Patents

With a broad patent portfolio enabling applications in the use of its transient phase liquid sintering materials, Ormet Circuits Inc. has benefited military and commercial customers in their complex circuitry design and assembly. Below, please find a listing of our active patents employed by many of our military and commercial customers. Subsequent filings can be addressed through our customer service staff by writing; support@ormetcircuits.net

Transient liquid phase sintering conductive adhesives
Patent Number 5853622 [Patent Office Link]

Electrically conductive compositions and methods for the preparation and use thereof
Patent Number 5376403 [Patent Office Link]

Electrically conductive compositions and methods for the preparation and use thereof
Patent Number 5830389 [Patent Office Link]

Multilayered printed circuit
Patent Number 5716663 [Patent Office Link]

Vertically interconnected electronic assemblies and compositions useful therefor
Patent Number 5948533 [Patent Office Link]

Ormet Patent listed in Germany
Patent Number 69233595-1 Patented in Germany

Ormet Patent listed in The United Kingdom
Patent Number 0646048 Patented in The United Kingdom

Ormet Patent listed in Italy
Patent Number 0646048 Patented in Italy

Ormet Patent listed in Australia
Patent Number 663342 Patented in Australia

Ormet Patent listed in Canada
Patent Number 2120523 Patented in Canada

Ormet Patent listed in Japan
Patent Number 2972338 Patented in Japan

Ormet Patent listed in Japan
Patent Number 3869859 Patented in Japan

Ormet Patent listed in Korea
Patent Number 128959 Patented in Korea

Composite substrates for preparation of printed circuits
Patent Number 5565267 [Patent Office Link]

Metal-plating of cured and sintered transient liquid phase sintering pastes
Patent Number 5922397 [Patent Office Link]

Novel metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
Patent Number 5980785 [Patent Office Link]

Process for producing high performance thermoelectric modules
Patent Number 6127619 [Patent Office Link]

Methods to produce insulated conductive through-features in conductive core materials for electronic packaging
Patent Number 6085415 [Patent Office Link]

Method of attaching circuitry to a modular jack connector using electrically conductive paste
Patent Number 6716036 [Patent Office Link]