Ormet's Time Has Come.

Ormet conductive materials are surging into wide use in many electronic applications. From radar antennas to semiconductor packages, complex circuit boards and electronic components and assemblies the products are finding uses visualized for them after their discovery in the 1990's and suggested in exciting technical reports over time.

Ormet™ ink was developed with a completely unique set of physical properties to align it with industry standard manufacturing methods. Ormet™materials provide high electrical and thermal conductivity, good solderability, adhesion to most substrates and low curing temperatures. During cure, Ormet™ink becomes a fused metal network that alloys itself to conventional circuit materials. The metal network is permeated by polymer that adheres to the substrate providing mechanical reinforcement. These properties represent the product of Ormet™ink's patented composition.

The breakthrough keys have been the development of application techniques offering the capability for high-speed throughput, lowest costs in manufacturing and the growing market need for maintaining and increasing product reliability while miniaturizing, adding complexity and operating at rising frequencies.

In recent years, a group of managers who have had many years and many successes commercializing and growing electronic companies have joined and invested in Ormet Circuits. Their initial efforts have been directed to studying and focusing on market opportunities for the Company and then on working with customers to perfect techniques for effectively applying Ormet materials.

There are many realized or potential applications for Ormet materials. Screened, sprayed, printed or dispensed by any technique and then heated to a temperature of 190 degrees Celsius, the material becomes highly electrically and thermally conductive (ten times more conductive than silver filled epoxies) and will remain stable to temperatures of 400 degrees. It's thermal coefficient of expansion is very close to that of copper and, it forms a metallic bond to any copper with which it comes into contact while being cured.

For many years Ormet inks have been employed to modify hundreds of thousands of printed circuit boards needing added component mounting lands or rerouting of traces. These boards have been used mainly in telecommunication equipment, instruments and military systems.

Ormet materials have been applied experimentally and successfully in many ways. Circuits and shielding have been applied to plastic, cardboard and paper. For example, circuits and shielding have been applied to plastic housings of connectors. RFID antennas have been created on cardboard boxes with the associated IC being fused simultaneously to the antenna by the Ormet ink. RoHS Conductive Adhesives are garnering attention from groups interested in surface mount technology processes under 215º Celsius.

However, the Company has chosen to concentrate, for the present, most heavily on the creation of electrical and thermal vias in multi layer structures. There are two primary types of applications. Blind or buried micro vias may be filled and cured rapidly and simultaneously. Rather than using sequential plating operations as would be required with an alternative approach, all the micro vias may be created in bond-ply layers, stacked and cured in a matter of minutes.

When plated vias are employed the holes may be filled with Ormet material. This material will form a metallic bond to the plated copper, increasing thermal and electrical conductivity and greatly improving strength and ability to withstand shock and vibration conditions.

The Company can furnish full process instructions and names of experienced processors. A partial list of some of our fabricators under the "links" section of this website.