Selecting Die Attach Technology for High-Power Applications
Die attach is the process of making the electrical connection between the semiconductor device die and its package. Because it is the first packaging layer in contact with the die, its thermal characteristics are critical.
High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the creation or conservation of energy. These applications include motor control, HBLEDs, solar concentrator cells, and RF and microwave circuits used in radar and telecommunications equipment. ....
Nov 1, 2009 12:00 PM JONATHAN HARRIS, President, CMC Laboratories, Inc. MICHAEL MATTHEWS, President, Ormet Circuits, Inc
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