Ormet™materials provide high electrical and thermal conductivity, good solderability, adhesion to most substrates and low curing temperatures. During cure, Ormet™ink becomes a fused metal network that alloys itself to conventional circuit materials. The metal network is permeated by polymer that adheres to the substrate providing mechanical reinforcement. These properties represent the product of Ormet™inks patented composition. Applications for its use lie in the connection of copper layer pads in the z plane along with filling plated vias for the thermal transfer of heat away from the silicon. “Innovative Solutions In Material Science”
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