"Innovative Solutions In Material Science"
Ormet™ sintering paste was developed with a completely unique set of physical properties to align it with industry standard manufacturing methods. Ormet™materials provide high electrical and thermal conductivity, good solderability, adhesion to most substrates and low curing temperatures. During cure, Ormet™sintering paste becomes a fused metal network that alloys itself to conventional circuit materials. The metal network is permeated by polymer that adheres to the substrate providing mechanical reinforcement. These properties represent the product of Ormet™sintering paste's patented composition.
The breakthrough keys have been the development of application techniques offering the capability for high-speed throughput, lowest costs in manufacturing and the growing market need for maintaining and increasing product reliability while miniaturizing, adding complexity and operating at rising frequencies.
Ormet's Technology is a Platform Used in a Wide Range of Electronics Applications
More About Ormet Circuits News and Press (What is in these days?)
TECHNOLOGY
Ormet™materials provide high electrical and thermal conductivity, good solderability, adhesion to most substrates and low curing temperatures.
APPLICATIONS
Applications for its use lie in the connection of copper layer pads in the z plane along with filling plated vias for the thermal transfer of heat away from the silicon.
PRODUCTS
Ormet has been developing and perfecting applications of its ink and paste products based on the Company`s unique liquid phase sintering technology.
ORMET UNIVERSITY
Online video training and written illustrated guides for the application and usage of Ormet superior materials. For more information call Ormet.
ENVIRONMENTAL
A family of products, including lead free versions that are now being introduced to the industry. Ormet is currently supplying inks to companies both in the U.S.and Asia.