"Sintering, Electrically Conductive Interconnect Materials"
Ormet Circuits, Incorporated (Ormet) is a leader in the design, manufacture, and sale of sintering, electrically conductive materials for use in the manufacture of advanced electronic devices. Located in San Diego, California, the Company has distribution and representative organizations throughout the world.
"Every Layer Interconnect Technology Using Transient Liquid Phase Sintering Materials"
Market requirements for hand held mobile and pocketsize devices are driving circuit board technology to stacked microvia interconnect technology. Ormet supplies sintering interconnect materials with process knowledge and Intellectual Property Rights in TLPS technology designed to enable high performance PCB designs. Fabricators using Ormet`s technology are capable of manufacturing micro-via products and high-layer count boards which offer the best signal integrity for high speed transmission.
Ormet`s commercial success in enabling high performance PCBs with TLPS technology is now providing opportunities in the low cost mobile devices market. Learn more by viewing the linked presentation about the drivers for TLPS materials and its market adoption. Samples can be provided by contacting your local sales agent or through this link.
Every Layer Via Value PropositionOrder a sample of our materials
"Lead Free Power Die Attach"
The electronics industry is pushing forward to reduce the use of hazardous materials in the manufacture of components and assemblies. Ormet is working with the leaders in the power semiconductor industry to commercialize the next generation Pb-free die material for power semiconductor devices such as MOSFETs, thyristors and LEDs. Learn more by viewing the linked presentation about the drivers and properties for TLPS die attach materials and its market adoption. Samples can be provided by contacting your local sales agent or through this link.
Order a sample of our materials
TECHNOLOGY
Ormet Circuits provides conductive pastes that enable electrical interconnection and thermal management in electronic substrates, components and assemblies.
ORMET UNIVERSITY
Register to contact Ormet for online video training and written illustrated guides for the application and usage of TLPS materials. Browse the links and find our trained partners.
APPLICATIONS
Increasing complexity of Power Semiconductor packaging and high density interconnects in IC substrate and Printed Circuit Boards has created opportunity for Ormet`s Unique material compositions.